Intel EMIB yields hit target, MediaTek eyes 2028 ASIC ramp

Дата публикации: 03-08-2026 02:38:20

MediaTek said at its latest earnings call that its second-generation data-center ASIC product remains on schedule for mass production in 2028, and that the Intel embedded multi-die interconnect bridge (EMIB) advanced packaging process it uses has already reached a very good yield level. MediaTek also said its first-generation product remains on track for volume ramp-up in the fourth quarter of 2026 and is expected to generate US$2 billion in revenue.

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