Built-in quantum sensor detects bending stress in microscopic devices

Дата публикации: 09-09-2026 14:00:09

Microelectromechanical systems (MEMS) are tiny devices used in technologies such as microphones, accelerometers and biosensors. MEMS are highly useful but prone to physical stress that affects their performance, stability and reliability. Tracking this interference is important, but attaching a separate sensor to such a minuscule structure is no easy task.

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